SEICA, a global leader in advanced electronic test solutions, will make its debut at CHIPEX Israel 2026, taking place May 12–13 in Tel Aviv. At Booth F79–81, the company will present its latest innovations for testing high-density probe cards and power semiconductors, including two new systems from the S20 line introduced in 2025.
As the demand for higher performance and reliability in power semiconductors continues to accelerate, SEICA stands out as a key enabler for the probe card test market. By combining deep application expertise with cutting-edge technology, SEICA delivers high-value test solutions that empower manufacturers to push the limits of performance, yield, and scalability. From R&D to high-volume production, its platforms are designed to support next-generation devices, including SiC and GaN, helping customers reduce time-to-market while ensuring the highest levels of quality and efficiency.
Among the highlights is the Pilot VX HR XL, a next-generation flying probe platform designed for comprehensive probe card testing. The system combines hardware and software in a single solution, supporting pre-assembly testing, in-circuit and functional testing, and final probe card validation. With advanced DSP-based measurement technology, ultra-fast capacitive testing, and support for large and complex boards, the Pilot VX HR XL delivers high accuracy, speed, and flexibility for semiconductor applications.
This vertical system integrates hardware and software within a single platform and supports three types of testing:
- testing of individual MLO and PCB boards before assembly,
- in-circuit (ICT) and functional testing of assembled PCBs,
- final probe card testing, combining the PCB with the MLO.
The final test includes ICT verification of every connection between the MLO and PCB interface. The Pilot VX HR XL automatically generates dedicated test programs, accounting for variations in resistance due to differences in network lengths or MLO components.
SEICA also offers the S20 IS³, a cutting-edge system for testing discrete power devices such as SiC and GaN components. Designed for both static and dynamic analysis, it ensures precise characterization of key electrical parameters, helping manufacturers improve reliability and performance while reducing field failures.
Its advanced measurement system integrates DC static and AC dynamic testing in a single platform (“one-box” solution), delivering precise and repeatable results. The modular and scalable configuration allows users to expand capabilities and increase throughput (UPH) as needed.
The intuitive, menu-driven software simplifies test setup, while integrated tools such as the oscilloscope support debugging and ensure full traceability of results.
Completing the lineup, the S20 RTH system provides accurate thermal resistance characterization with advanced power and cooling management. It enables detailed evaluation of thermal behavior in power devices, supporting optimized design, reliability, and safe operation.
Transistors—including MOSFETs, BJTs, and IGBTs—are among the most critical semiconductor devices and are particularly sensitive to the interaction between power handling and input signals. In modern power supply design, both system efficiency and junction temperature are key considerations.
The S20 RTH evaluates thermal stress in power MOSFETs operating in switch-mode power supplies. By combining measured data with device physical characteristics, it enables accurate prediction of junction temperature and determination of appropriate thermal margins and heatsink requirements. This approach is essential for ensuring reliability, longevity, and safe operation within the device’s Safe Operating Area (SOA).
Both S20 platforms feature modular, scalable architectures, compact design, and intuitive software, ensuring flexibility and ease of integration into modern production environments.
Visit SEICA at Booth F79–81 to discover how its latest innovations are driving the future of semiconductor testing.
To learn more, visit www.seica.com.
