Indium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on a new liquid metal containment method for thermal interface material (TIM) applications at the IMAPS Thermal Conference, to be held October 2 in San Diego, California. The conference will be co-located with the IMAPS International Symposium on Microelectronics.
The presentation, Haggis: A New Method of Liquid Metal Containment for Advanced TIM Applications, will explore the Haggis concept, which allows for prewetting specific liquid metals onto a metal core using a combination of very low bondline thickness of liquid metal and wetting to the metal sheet to internally constrain the liquid metal, preventing squeeze out and loss during drop shock. Dr. Mackie will present data to show how the judicious choice of liquid metal and solid metal core facilitates long-term stability in advanced applications.
“Liquid metals have very high surface tensions and low viscosities and are increasingly being used in advanced complex integrated systems, where logic die power densities of 2kW/cm2 and higher will soon be commonplace,” said Dr. Mackie. “Liquid metal-based TIMs must, therefore, have extremely low thermal resistances and be able to survive at high temperatures with significant thermomechanical stresses due to power cycling.”
Dr. Mackie is an electronics industry expert specializing in the convergence of novel materials, emerging technologies, and potential business impact. His professional experience encompasses all aspects of materials and processes for electronics manufacturing from wafer fabrication to semiconductor assembly and packaging, as well as SMT/electronics assembly.
In his current role at Indium Corporation, Dr. Mackie focuses on identifying thermal materials needs and trends for various high-performance applications, as well as developing and testing innovative solutions to meet emerging thermal interface materials requirements.
Dr. Mackie has been an invited international keynote speaker and has lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie has a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master of Science degree (MSc) in colloid and interface science from the University of Bristol, UK.
The presentation will take place on Friday, October 3, from 11:00 a.m. to 11:30 a.m.
To learn more about Indium Corporation’s innovative TIM solutions, visit https://www.indium.com/products/thermal-interface-materials/.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
