TopLine and Tanaka Precious Metals will exhibit in Booth #2132 at the IMS Show in San Francisco June 15-20 at the Moscone Center. Tanaka Precious Metals is the premier manufacturer of bonding wire to the semiconductor industry. Tanaka offers a full range of Gold (Au), Silver(Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) covering all applications of wedge, ball and bump bonding. They also provide high performance flat Gold and flat Al ribbon for RF modules and power applications, and Pt Alloy Wire.
At the show, meet Jared Wilson, Director of Sales, who is ready to discuss bonding wire solutions with visitors. Contact him at Tel: +1-800-776-9888, or email: Tanaka@TopLine.tv.
About TopLine
TopLine manufactures a wide range of solder columns for CCGA semiconductor packages, and provides Daisy Chain CCGA packages for engineering development, profiling and practice. TopLine products provide hands-on learning for engineers. TopLine is a pioneer in CGA solder columns technology and low temperature cryogenic package-to-board interconnects.
