Indium Corporation® is set to introduce its newest Heat-Spring® pattern—HSx. Designed for large area dies with warpage challenges and pressure limitations, HSx will be introduced at TestConX 2025, taking place March 3-5 in Mesa, Arizona.

As a global leader in high-performance metal thermal interface materials (TIMs), Indium Corporation will showcase the following selections from its array of high-performance metal TIM solutions:

Heat-Spring® HSx (New)

  • Newest pattern designed for large area dies with warpage >200 microns
  • Effective thermal conductivity of 16W/m-K at only 20psi with pure indium
  • Designed for test heads where clamping forces are limited to <30psi
  • Thickness ranging from 300 micron up to 1mm
  • Available with or without a diffusion barrier to prevent staining of the die

Heat-Spring® HSD

  • The original and best standard option for interfaces with flat, smooth, and parallel surfaces
  • Designed for interfaces with tight surface control >30psi

Heat-Spring® High Profile Preforms

  • Patterned to optimize contact with non-planar surfaces delivering 86W/mK
  • Ideal for assemblies with an extruded, unfinished heat-sink
  • Recommended for immersion cooling and burn-in applications
  • Provides uniform contact between the burn-in head and the DUT
  • Provides more uniform thermal conductivity

Heat-Spring® HSK

  • Recommended specifically for burn-in applications where multiple insertions are required
  • Provides uniform contact with low resistance for high-density heat loads
  • Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications
  • No staining or cracking

All Heat-Spring® products are recyclable and reclaimable.

To learn more about Indium Corporation’s metal TIMs for burn-in and test, visit our experts at booth #45 at TestConX, or online at indium.com/TIMs.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.

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