TopLine® Corporation will sponsor an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding February 3-4, 2025, in San Diego, California, hosted by The International Microelectronics Assembly and Packaging Society (IMAPS), it is announced today.
The objective of the Wire Bonding Workshop is to create a unique forum that brings together scientists, engineers, manufacturing, academia, and marketing people from around the world who have been working in the area of Wire Bonding. According to TopLine CEO Martin Hart, “This workshop has been specifically organized to allow for the presentation and debate of some of the latest technologies available related to the use of Wire Bonding in battery packs, and in semiconductor and microelectronic packaging.” The workshop will be held at the Westin San Diego Bayview; for more information, contact info@imaps.org, Tel. 919-293-5000.
About TopLine
TopLine is the exclusive distributor for Tanaka-made bonding wire. Tanaka is the world’s premier manufacturer of the full range of Gold (Au), Silver (Ag), Aluminum (Al), bare Copper (Cu) and Palladium Coated Copper (PCC) wire covering all applications of wedge, ball and bump bonding. And Yes – Only One Spool is OK! To learn more, visit www.TanakaWire.com, or call (1+) 800 – 776-9888.
