SHENMAO America, Inc. is proud to introduce its latest innovation in response to the rising demand for ultra-thin electronic packages. As package thinness increases, issues like package warpage and its detrimental effects on production yield have become critical challenges. SHENMAO is addressing these concerns with its new Low-Temperature Solder (LTS) materials, which are engineered to lower reflow temperatures, mitigating PCB and substrate deformation while enhancing overall yield rates.
A key offering in SHENMAO’s LTS lineup is the PF734-S and PF735-S low-temperature BGA solder spheres, designed specifically for low-temperature ball attachment processes. These solder spheres are paired with SHENMAO’s innovative flux materials: the low-temperature no-clean flux SMF-80 and water-soluble flux SMF-WC63, both tailored to the unique needs of different customers.
PF734-S is based on an enhanced low-temperature alloy and surpasses traditional low-temperature alloys like 42% Sn and 58% Bi. Its improved mechanical properties offer superior product reliability, even under rigorous testing such as thermal cycling and thermal shock. Meanwhile, PF735 provides better ductility, finer microstructure, and improved drop and thermal reliability. With a lower liquidus temperature, PF735 further reduces process temperatures while maintaining a narrow pasty range.
SHENMAO’s flux solutions are equally impressive. The no-clean flux SMF-80 eliminates the need for post-reflow cleaning, offering high reliability and minimal flux residue. In contrast, the water-soluble flux SMF-WC63 is known for its excellent cleanability, allowing manufacturers to easily remove any residue post-reflow, resulting in exceptional surface cleanliness. Both SMF-80 and SMF-WC63 are halogen-free and fully compliant with RoHS, RoHS 2.0, REACH, and other relevant environmental regulations.
With these advanced low-temperature process solutions, SHENMAO continues to drive innovation, offering electronics manufacturers the tools they need to meet the challenges of modern electronic package production while advancing environmental stewardship.
For more information about SHENMAO and its certified recycled solder materials, please visit www.SHENMAO.com.
