SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO’s latest advancements in solder paste technology.

In response to the escalating demands for heightened product reliability and safety in automotive electronic components, SHENMAO proudly presents comprehensive solutions tailored to meet the specific needs of the automotive electronics industry.

SHENMAO will introduce the PF918-P250A Thermal Fatigue Resistance No-Clean Lead-free Solder Paste, meticulously formulated with the groundbreaking SHENMAO Sn/4Ag/3Bi Alloy. This innovative alloy is engineered for high thermal impact reliability, ensuring the longevity of electronic products with stringent reliability requirements. Notably, it excels in voiding performance and printability, mirroring the melting point of SAC305 for seamless integration into existing SAC305 reflow profiles. With its cutting-edge flux design, voiding is effortlessly controlled to less than 10 percent.

Furthermore, extensive Board level thermal cycling tests, utilizing an actual automotive IC product, reveal that the thermal cycling life of PF918 surpasses that of the SAC305 alloy, doubling its longevity. PF918-P250A enhances thermal reliability performance by a minimum of 30 percent, demonstrating superior mechanical shock resistance compared to typical solder alloys like SAC305 and SAC405. This solder paste is ideal for various applications, including consumer electronics, high-power components, servers, and automotive electronics.

Supplementing this advanced offering is the PF606-P250 No-Clean Lead-free Solder Paste, featuring the widely used Sn/3Ag/0.5Cu Alloy. PF606-P250 stands out with its impressive solderability, printability, and voiding performances, while remaining compliant with RoHS, RoHS 2.0, and REACH standards.

For those prioritizing water-soluble options, the PF918-PW216 Thermal Fatigue Resistance Water-Soluble Lead-free Solder Paste is specially designed for water cleanability. Formulated with the newly designed high-reliability lead-free alloy (Sn/4Ag/3Bi), it achieves tensile strength performance 1.4 times higher than typical SAC305 alloys. Its innovative flux design ensures outstanding voiding performance, allowing it to seamlessly follow the regular SAC305 reflow profile. This solder paste caters to the needs of consumer electronics, servers, automotive electronics, and electronic products with extended service life and high reliability requirements.

Also available is the PF606-PW216 Water-Soluble Lead-free Solder Paste, which adheres to the commonly used Sn/3Ag/0.5Cu Alloy, offering excellent cleanability, solderability, printability, and voiding performance.

In order to enhance the solder joint protection, SHENMAO has launched two specialized products with built-in epoxy. The Joint Enhanced Solder Paste (JEP) PF606-EP305 seamlessly combines the advantages of conventional solder paste and anisotropic conductive paste, delivering self-alignment and planar insulation. JEP facilitates soldering and joint encapsulation in one-step reflow, featuring a new epoxy-based solder material designed for very fine pad size (70 μm) soldering. It is compatible with various surface finishes, leaving a transparent residue, and requires no cleaning. SHENMAO’s JEP is eco-friendly, boasting both lead-free and halogen-free attributes, meeting J-STD and IEC standards.

Finally, the SMEF-Z52 Active Epoxy Flux is designed for SMT assembly (SAC paste) and BGA ball mount (SAC ball) processes. The activator eliminates solder balls, ensuring smooth solder joints. Post-reflow, the epoxy flux residue cures to provide mechanical support to the joint. Epoxy clad in solder joints after curing shields and strengthens joints by 30 percent compared to conventional rosin flux. This newly designed flux requires no cleaning and exhibits exceptional compatibility with molded underfill (MUF) and capillary underfill (CUF). SMEF-Z52 is well-suited for various IC packages, including system-in-package (SIP), wafer-level-package (WLP), and flip-chip technologies.

SHENMAO’s advanced pastes and fluxes are compliant with RoHS, RoHS 2.0, and REACH standards.

Visit SHENMAO at the 2024 IPC APEX EXPO to experience firsthand the innovative solder technology driving the future of automotive electronics manufacturing.

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