Heraeus Electronics is excited to announce its participation in the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. Heraeus Electronics will be exhibiting in Booth 3912, showcasing its cutting-edge products, including the award-winning Microbond® SMT660 Innolot® 2.0 solder paste.
Microbond® SMT660 Innolot® 2.0 – A Game-Changing Solution
Since its introduction, Heraeus Electronics’ Microbond® SMT660 Series has received prestigious awards such as the Mexico Technology and Global Technology Awards. The solder paste is revolutionizing the automotive industry’s approach to highly reliable and cost-effective solder alloys. The Microbond® SMT660 flux, in combination with different alloys, delivers exceptional performance and reliability.
The SMT660 Series offers exceptional reflow performance, standing out for its excellence in the reflow process without the need for additional nitrogen (N2). This feature minimizes defect rates and contributes to a reduced Total Cost of Ownership (TCO) for manufacturers. Heraeus Electronics’ innovation aligns with the industry’s need for reliability and cost-efficiency, making the Microbond® SMT660 an indispensable asset for the automotive sector.
Microbond® SMT650 High-Reliability Solder Paste
Additionally, Heraeus Electronics will highlight its full sinter paste and solder paste portfolio of products, including the Microbond® SMT650. The high-reliability solder paste achieves consistently high surface insulation resistance to prevent electrochemical migration. The combination of the new F650 flux system with the Innolot® alloy delivers superior reliability, particularly in miniaturized systems within the automotive industry.
mAgic® DA320 – High Shear Strength Sinter Paste for Power Applications
mAgic® DA320, an innovative sinter paste, will be a focal point of Heraeus Electronics’ exhibit. This high shear strength, non-pressure dispensing sinter paste is designed for die attach of power applications. With features like fast sintering, high shear strength, and high thermal conductivity, mAgic® DA320 is ideal for Silicon Carbide (SiC), Gallium Nitride (GaN), and other cutting-edge power devices.
Visit Heraeus Electronics at Booth 3912 during the 2024 IPC APEX EXPO to explore these groundbreaking solutions firsthand. The Heraeus team will be available for in-depth discussions and to address any inquiries.
Heraeus Electronics remains at the forefront of innovation, continually pushing boundaries and introducing solutions that empower manufacturers to thrive in a dynamic and evolving market.
To learn more about Heraeus Electronics, visit www.heraeus-electronics.com.
