The SMTA is excited to introduce a new event for the electronics manufacturing industry which takes place on March 26, 2024 in Peoria, Arizona, USA. The Ultra High Density Interconnect Symposium will be held at the Peoria Sports Complex.

This event sets the stage for researchers, engineers, designers and academia to address the complexities and innovations reshaping the world of Ultra HDI technology, which is producing printed circuit boards and semiconductors with lines and spaces well below 50 microns. The program will focus on all areas impacted by the technology including PCB Design, Fabrication, Assembly and Reliability.

A co-located breakfast event will start the day with a discussion on the topic of workforce development, identifying key competencies for semiconductor technology and PCB electronics. The breakfast is open to anyone interested in workforce development for electronics manufacturing, not just conference attendees, and an additional registration fee is required to attend.

Altium and American Standard Circuits are the current sponsors of the symposium. Sponsorship opportunities are still available for this event. View more details online.

If there are any questions, please call +1-952-920-7682 or email For more information, visit

SMTA – A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.