“Our Focus – Your Solution” is in our DNA to help improving your production environment.
Meet Essemtec in Hall B2.103 (main booth) and Hall A3.134, November 14th – 17th!

Discover Essemtec’s top three SMT- solutions below:

High-Speed Solder Paste Jetting – for all product platforms

Since 2019 Essemtec continuously improved the solder jetting process. More than 100 systems are worldwide in production. At Productronica a huge, improved solder jet speed of 180’000 – 400’000 dots/h will be presented. It is now possible to exchange inflexible solder screen printer with a P&P integrated solder jetting solution to serve up to 3 Pick and Place machines. SMEs solder jet products in All-in-One Systems or high-speed production integrate the system for process improvement capability.

Watch Video Here ->

Integrated Inspection System – for all product platforms

First time in the industry an Integrated Inspection System (I2S) in the Pick and Place and dispensing solutions is presented at Productronica.
The Integrated Inspection System is available for inspection of dispensed and jetted material as well as placed SMD components right after the process, to ensure only good, inspected products are entering the reflow ovens.
The process also includes an automated repair function.
The system is already integrated in automotive and complex production sites but also at KMUs which partially can avoid investing in expensive SPI and AOI systems.

Watch Video Here ->

Smart Material Management – integrated solution for factory 4.0

The affordable material management solution is a fully integrated end-to-end solution for electronics manufacturing factories and covers all different storage location. The solutions enable the right material to reach the right place at the right time. The traceability is precise down to individual component.
The solution is expandable and flexibly controlled by an intuitive eStorage software, from simple barcode-labelled storage location to fully automated storage cabinets and pick by LED. The solution offers high ROI and is fully integrated with the production machine and the ERP systems.

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More new solutions will be presented, like loose component feeder, new strip and label feeder as well as 4mm and 88-120mm feeder.

Our solutions address different areas of electronics production:
➤ All-in-one NPI
➤ High-mix, low-volume
➤ High-speed dispensing
➤ Printed electronics
➤ Complex, volume repair
➤ Beyond SMT

In hall B2.103 and A3.134 – Live demos of all New Solutions demonstrating their added value.

The Essemtec Team is looking forward to meeting you!