Surfx Technologies, LLC, to announce its participation in productronica 2023, one of the industry’s premier trade shows for electronics manufacturing and assembly. The company will be focusing on its revolutionary flux-free flip chip and hybrid wafer bonding technologies, showcasing its commitment to advancing semiconductor manufacturing processes. The event is scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany.

Two distinguished manufacturer representatives will represent Surfx Technologies at productronica this year, providing attendees with valuable insights into the company’s cutting-edge solutions.

Novel-Technology Transfer GmbH Hall B1, Stand 916:

Visit the expansive booth of Novel-Technology Transfer GmbH to witness Surfx Technologies’ flagship product, the STA-10iL machine, in action. This state-of-the-art machine is configured for cleaning and oxide removal from 300mm wafers, and attendees will have the opportunity to witness live demonstrations, gaining firsthand experience of its capabilities.

The live demonstrations will highlight the effectiveness of the STA-10iL machine in providing flux-free cleaning solutions for semiconductor wafers. Surfx’s unique technology ensures a pristine wafer surface, essential for achieving high-yield and high-performance semiconductor devices.

In addition to the live demonstrations, a video reel will be presented, showcasing the STW wafer cleaning tool and various Atmospheric Argon Plasma cleaning applications tailored to the semiconductor industry. This multimedia presentation will provide attendees with a comprehensive understanding of Surfx’s wide-ranging capabilities in surface treatment.

Bentec Hall A3, Stand 120:

Bentec, another respected industry representative, will be featuring a dedicated section of their booth for Surfx Technologies. Attendees can visit this area to learn how Surfx’s Atomflo™ technology will revolutionize the PCB manufacturing landscape.

“We are excited to be part of productronica 2023 and to have the opportunity to showcase our flux-free flip chip and hybrid wafer bonding technologies,” said Robert Hicks, President & CEO at Surfx Technologies. “Our presence at this event reflects our dedication to advancing semiconductor manufacturing processes and providing our customers with the most reliable and effective surface treatment solutions.”

Surfx Technologies invites all productronica attendees to visit the Novel-Technology Transfer GmbH and Bentec booths to witness these ground-breaking innovations in action and learn more about the future of clean surfaces throughout semiconductor manufacturing.

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