The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use lead-free solder alloys containing low melting point elements such as tin, cadmium, or indium. In this white paper, Circuit Technology Center discusses a number of critical considerations when using an automated robotic hot solder dip process to mitigate tin whiskers before circuit board assembly.
See the full paper at: www.circuitrework.com/features/1037.html.
