Indium Corporation will share its industry knowledge and expertise on topics including high-temperature lead-free solder pastes for power discrete applications, and low-temperature solder pastes for wafer-level packaging applications, during two presentations at the International Electronics Manufacturing Technology (IEMT) conference, Oct. 19-21, Putrajaya, Malaysia.
Indium Corporation’s Durafuse™ HT, Sn-based high-temperature lead-free (HTLF) solder pastes designed with Durafuse ™ technology and the combined merits of two constituent alloys, have been developed as drop-in solutions to replace the high-Pb solder pastes in power discrete applications. In his presentation, A Drop-in High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications, Dr. HongWen Zhang, R&D manager, alloy group, will examine the results of a study that compared Durafuse™ HT’s performance to high-lead products.
In his presentation on low-temperature solder paste, Novel Lead-Free Lower-Temperature Solder Paste for Wafer-Level Package Application, Zhang examines the results of testing an indium-containing, low-temperature solder paste—Indium Corporation’s Durafuse™ LT—for wafer-level package (WLP) applications. During the test, Durafuse™ LT, regardless of reflow profiles, outperformed SAC305.
Dr. Zhang is manager of the alloy group in Indium Corporation’s R&D department. His focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the mixed-alloy solder technique to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability. Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry from Central South University of China, a master’s degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a master’s degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610 as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.
About Indium Corporation
Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
The International Electronics Manufacturing Technology (IEMT) Conference is the premier IEEE event devoted to the manufacture of electronic, opto-electronic, and MEMS/sensors devices and systems. IEMT is an established international conference of long-standing organized by the Electronics Packaging Society (EPS) Society of IEEE. The 39th International Electronics Manufacturing Technology (IEMT) Conference 2022 is organized by the IEEE EPS Malaysia Chapter with technical co-sponsorship from IEEE EPS Santa Clara Valley Chapter and IEEE Malaysia Section.