Bondexpo is regarded as a leading trade fair for bonding technology and is an important venue for companies involved in industrial dispension and attaching. From 4 to 7 October, Rehm Thermal Systems will be presenting its product portfolio covering the fields of dispensing, adhesive technology and application processes for the third time at the Stuttgart Trade Fair Centre. This includes the innovative system ProtectoXC. Come and see for yourself – at the Rehm stand in Hall 5, 5508.

As a global manufacturer and supplier of a wide range of application processes for dispension and attaching technology, Rehm Thermal Systems is able to present its customers particularly versatile and process-reliable solutions. This year for the first time, Rehm is appearing at Bondexpo, the leading fair for all matters connected with adhesive technology. ‘As a leading global fair, Bondexpo is thought of as one of the foremost important meeting points for the industry. We can see that our international customers are looking for our new technologies and our global support, so we are pleased to be present at Bondexpo again this year’, states Michael Hanke, chief sales officer at Rehm. ‘With the diverse opportunities available to us for global networking in manufacturing – say via MES or ERP systems – we can provide our customers with the right technologies and the systems specific to their needs. This includes the ProtectoX series of bonding and dispensing systems’, adds Hanke.

The ProtectoX Series

The Protecto systems extend reliable, automated processes and precision results in the application of a wide range of materials. With solid machine engineering and diverse applications, Protecto is a strong contender in the fields of dispensing and adhesive technology. Up to 4 applicators can be used simultaneously, allowing the operator a wide range of options. In addition to dispensing, the ProtectoX series also offers the possibility of creating freely definable housing shapes in the third dimension. ProtectoX systems allow immediate hardening of UV lacquers, while various materials can also be cast or bonded. The systems are also designed to afford dependable surface activation and cleaning using plasma. ‘Rehm has supplied complete, innovative thermal system solutions for years, and we are delighted to be able to present all this at Bondexpo’, declares Michael Hanke.


Precision bonding for optimal results

About Rehm Thermal Systems
As a specialist in thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in modern, economically viable production of electronics assemblies. A globally active manufacturer of reflow soldering systems based on convection, condensation or vacuum, plus drying and coating systems, function testing systems, metallisation equipment for solar cells and numerous special and custom systems, we have a presence in all the relevant growth markets. As a partner with more than 30 years of industry experience, we create innovative production solutions that set standards.