Heraeus Electronics today announced plans to exhibit in Hall 6, Booth 322 at PCIM Europe, the leading conference and exhibition for power electronics, renewable energy and energy management. The event is scheduled to take place May 10-12, 2022 in Nuremberg. In parallel to PCIM Europe, SMTconnect will take place in halls 4, 4A and 5.

While at the show, visit Heraeus Electronics in Hall 6, Booth 322 to speak with the team about the global launch of its two new products: Condura®.ultra Ag free AMB Substrate and PowerCu Soft LRB Laser Bondable Ribbon, as well as its other new solutions for interconnects and die attach. In addition to introducing its two newest products at the event, Heraeus Electronics will present during the E-mobility Forum.

​The presentation entitled, “How Near is Copper Sintering?” is scheduled to take place May 10, 2022 at 11:20 a.m. CEST.  Dennis Ang, Global Product Manager – Die Attach and Sinter Products, and Susanne Klaudia Duch, Project Development Leader – Copper Sinter Paste, will present comparisons, benefits and application scenarios of using Cu as an assembly material.

Silver (Ag) sintering is rated highly for its superb thermal and electrical conductivity as well as excellent reliability. It is therefore a perfect solution for the megatrend towards lifetime increase and efficiency improvement of power electronic devices in electromobility. It has taken many years for sintering with silver to be accepted for high power applications. Trends continue to indicate positive adoption of Ag sintering.

Proliferation to other segments is observed to be limited due to multi-fold cost increase, being it is silver after all. Amongst the many alternatives to replace silver, one is gaining momentum which can improve cost attractiveness and has shown excellent performance. Here, the presenters will provide more information on their investigation with regards to Copper (Cu) sintering.

The presentation entitled, “Al2O3, ZTA, AMB and What’s Next?” is scheduled to take place May 11, 2022 at 12:50 p.m. CEST. Bastian Schlüter, Global Product Manager -Metal Ceramic Substrates, will discuss how e-mobility applications and rising customer expectations put pressure on the reliability, thermal performance, lifetime and price of metal ceramic substrates. Heraeus Electronics offers with Condura® a comprehensive substrate portfolio supplemented by a variety of services beyond. DCB-Al2O3 substrates (Condura®.classic) are the long-proven standard.

For higher mechanical performance Zirconia-toughened DCB-Al2O3 (ZTA) substrates (Condura®.extra) are the material of choice. Excellent mechanical properties and a high thermal conductivity make Active Metal Brazed (AMB) Si3N4 substrates (Condura®.prime) an ideal material for high-reliable e-mobility modules. This year Heraeus Electronics welcomes a new member to the Condura® family. Look forward to the next generation of substrates that combines individual advantages to one new substrate material.

To learn more about Heraeus Electronics’ two new product launches, stop by Hall 6, Booth 322 during PCIM Europe or visit heraeus-electronics.com

About Heraeus
Heraeus, the technology group headquartered in Hanau, Germany, is a leading international family-owned portfolio company. The company’s roots go back to a family pharmacy started in 1660. Today, the Heraeus group includes businesses in the environmental, electronics, health, and industrial applications sectors. Customers benefit from innovative technologies and solutions based on broad materials expertise and technological leadership. In the 2020 financial year, the FORTUNE Global 500 listed group generated revenues of €31.5 billion with approximately 14,800 employees in 40 countries. Heraeus is one of the top 10 family-owned companies in Germany and holds a leading position in its global markets. Heraeus Electronics, a global business unit of Heraeus, is an expert for materials and matched material solutions for the electronics packaging.

About Heraeus Electronics
Heraeus Electronics is a leading manufacturer of materials for the assembly and packaging of devices in the electronics industry. The company develops materials solutions for the automotive, power electronics and advanced semiconductor packaging market and offers its customers a broad product portfolio – from materials and material systems to services.