MacDermid Alpha Electronics Solutions, a global leader of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in innovative electronics design and manufacturing, will be presenting the technical paper “Next Generation Interconnect Materials for Smart, Functional, and 3D HMI Surfaces” at the LOPEC 2022 Exhibition and Conference taking place March 22 – 24, 2022 at the Messe München, Germany.
Dr. Nirmalya Kumar Chaki, Manager, Advanced Materials Research will present his recent research as part of the Functional Materials session. His presentation will focus on three central technologies; compatible electronic inks for In-Mold electronics, formable silver inks, dielectric inks and adhesives, in addition to structural, 3D In-Mold Electronics demonstrators. In-Mold Electronics (IME) technology integrates the existing Film Insert Molding (FIM) process with electronics, which allows for design freedom and manufacturing flexibility, as well as savings in costs, weight reduction and a 30% decrease in carbon footprint. With the addition of conductive circuits using MacDermid Alpha’s electronic inks, only one process is required to produce conformable (non-rectangular/planar/freeform) automotive parts with embedded functional electronics. Applications for this technology in automotive interiors include in-vehicle infotainment, overhead console panels (OHCP), center console, and audio controls.
MacDermid Alpha is developing a suite of conductive inks and materials to meet the unique requirements and reliability standards for Peel-N-Stick Sensors and In-Mold Electronics. We offer a comprehensive suite of fully compatible materials, processing and applications support for our films, electronic inks & adhesives to produce 3D Smart, Functional and 3D Automotive HMI (Human-Machine Interface) Structures. Our film capabilities include functional and decorative solutions, such as Autotype heat-stabilized PET and PC films. Additionally, our electronic materials portfolio provides integrated electronics capabilities for the printed circuit board and semiconductor industries. We provide solutions for the entire electronics device stack, due to the inter-compatibility & adhesion of our substrates and electronic ink layers.
MacDermid Alpha’s products for Peel-N-Stick Sensors & IME include:
- Formable PET & PC Films / Substrates
- Formable Conductive Inks
- Formable Dielectric Inks
- Electronic Joining Materials
Dr Chaki will be delivering his paper on Wednesday, March 23 at 5:20 pm. To register for the presentation, please visit the LOPEC website (link) . For more information about MacDermid Alpha’s solutions for flexible and in-mold electronics please visit MacDermidAlpha.com.
