The Power Electronics Division of MacDermid Alpha Electronics Solutions, a global leader of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in power electronics packaging and assembly, will be presenting the technical paper “Automotive Traction Module Attach by Silver Sintering – Process, Performance, and Reliability” at the APEC 2022 Power Conference taking place from March 20-24, 2022 in Houston, Texas.

As sintered silver technology continues to replace traditional solder materials for die attach applications, the bottleneck for further inverter reliability improvement is shifting to the heat sink level. Direct cooled pin-fin modules, without baseplate and thermal grease, have been shown to have lower thermal resistance. In this paper, Gyan Dutt, Global Portfolio Manager for Power Electronics, will introduce a novel large area dispense process for silver sintering paste application that is particularly suited for transfer-molded power packages.

Dutt will define the application process steps, review the results of assembly characterization, and discuss  reliability improvements by silver sintering (over solder) with commercially available SiC MOSFET modules. “Module to heat sink sintering, along with sintered die top attach, is the next frontier for further reliability and power density improvements for EV traction power modules and inverters. The system level benefits in weight savings and cooling requirements will propel the use of sintering technology throughout the power assembly stack, especially for high end EVs” comments Dutt.

The paper will be delivered on Wednesday, March 23, 2022 at 5:10 – 5:45 pm.  To learn more about the APEC Conference and MacDermid Alpha’s vast product offering and capabilities, please visit

About MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions enables electronics interconnection through the innovative specialty chemicals and materials from our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands. We serve all global regions and all steps of device manufacturing within every segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate with OEMs and fabricators in the implementation of new technologies that redefine what is possible in device design. Our world class technical service is constantly at hand to ensure optimized outcomes in yield and productivity. Our solutions can increase throughput, reduce carbon footprints, lower total cost of ownership, and enable electronics innovation.