The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use various lead-free solder alloys containing low melting point elements such as tin, cadmium, or indium.

In this new technical paper, Circuit Technology Center discusses a number of critical considerations when using robotic hot solder dip to process components to mitigate tin whiskers prior to circuit board assembly.

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Circuit Technology Center, founded in 1979, continues to be recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling and component level modification services in the world.

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