Insituware LLC, the developer of the first smart measurement solution for quality control of materials, is pleased to announce that Morgan Miller, Application Engineer, will present during the SMTA International Conference, scheduled to take place Nov. 1-4, 2021 at the Minneapolis Convention Center. Ms. Miller will present: “Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Performance.”

Miller will discuss how handling and environmental conditions, such as temperature and humidity, are major factors that could contribute to significant changes in the physical, electrochemical, and mechanical properties of solder paste during production. When properly stored and handled, solder paste is unlikely to immediately start producing defects. However, any change in the viscoelastic characteristics can alter the expected behavior of the paste, potentially producing defects such as slumping, poor stencil life, skipping, etc.

These changes can be captured by Solder Paste Inspection (SPI), but only after the paste produces defects. This study is aimed at correlating Electrochemical Impedance Spectroscopy (EIS) measurements to printing defects as captured by SPI.

Miller has worked with Insituware for over 3 years. She started as a Lab Technician with Insituware while also studying biology and chemistry at Rowan University. She has always had a passion for research; initially studying her town’s watershed for E. Coli contaminates and then studying stem-cell regrowth of planaria after exposure to BPA. Once she received her bachelor’s degree from Rowan University, Miller was promoted to the R&D Lab Manager. She has participated in research and supervised multiple projects involving solder paste, conformal coatings, adhesives and corrosive residues. Transitioning into her new position as Field Application Engineer, Miller provides technical support to current customers, consults Insituware’s lab experiments and participates in joint research projects.

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