Automating wedge bonding for complex wire components

Automating Wedge Bonding for Complex Wire Components

RF and mmWave specialist, Filtronic has further enhanced its hybrid and semiconductor packaging capabilities by investing in a fully automated wedge bonder suitable for...
When Standard Grippers Are No Longer Enough – ASYS Develops Unique Gripper System with Rohde & Schwarz for the DIVISIO 5100 Depaneling System

When Standard Grippers Are No Longer Enough – ASYS Develops Unique Gripper System with...

Some innovations do not begin with a new machine. They begin with a simple question: How do you handle products that look different every...
IPC logo

Electronics Industry Continues to Show Resiliency Despite Rising Labor Costs and Recruiting Difficulties

According to IPC’s January Sentiment of the Global Electronics Manufacturing Supply Chain report, 75 percent of electronics manufacturers are experiencing rising material costs, while...
Kurtz Ersa HOTFLOW THREE reflow oven, VERSAFLOW 4 and HR 600 P rework system on display at SMTA expo

Circuit Solutions to Feature Kurtz Ersa Soldering Systems at SMTA Empire and Long Island...

Kurtz Ersa Inc., a leader of electronics production equipment will be represented by its authorized distributor Circuit Solutions at two upcoming New York SMTA...
Duck then Jump: Caution Advised on Global PCB Outlook for 2023

Duck then Jump: Caution Advised on Global PCB Outlook for 2023

2022 was an outstanding year for the global PCB industry. Global industry output reached 88.2 Billion USD with 3.2% annual growth despite pressure from...
Aegis Software Simio platform interface showing AI-powered simulation and production planning dashboard

Aegis Software Introduces AI-Powered Interaction for Process Simulation and Planning in Simio

Aegis Software, a global provider of manufacturing execution, simulation and planning software, today announced built-in Model Context Protocol (MCP) support in Simio. The new...
BTU Showcases the Ultimate Flux Management Solution at the SMTA Texas Expos

BTU Showcases the Ultimate Flux Management Solution at the SMTA Texas Expos

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the following upcoming events where...
KIC 2026 CIRCUITS ASSEMBLY Service Excellence Award for Soldering Equipment category based on customer feedback

KIC Earns 2026 Service Excellence Award Based on Customer Feedback

KIC, a leader in thermal process intelligence for electronics manufacturing, is proud to announce that it has received the 2026 CIRCUITS ASSEMBLY Service Excellence...
Seika Machinery to Sponsor and Present at the High Reliability Technology Advancement Research Forum

Seika’s New Next-Generation Fully Automatic Nozzle Cleaner Offers Cleaning, Inspection & Traceability

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to introduce the new Sawa SCI-EZY next generation fully...
KOKI Solder America booth displaying solder paste products and SMT assembly materials at SMTA International 2026

KOKI Solder America to Highlight Solder Paste Performance and Process Research at SMTA International...

KOKI Solder America Inc. will exhibit at SMTA International 2026, taking place October 25–29 at the Donald E. Stephens Convention Center in Rosemont, Illinois....