Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the suggestion to establish a partnership with an experienced soldering equipment supplier. This technical paper encompasses critically important information and is entitled “Be Selective in Partnering with a Soldering Equipment Supplier.” This 7-page tech paper outlines essential information for circuit board assembly processes and can be downloaded by visiting www.rpsautomation.com/news/technical-papers.
Topics covered within this publication include selective soldering offerings, selective soldering advantages, component lead tinning, gold removal and solderability testing methods. The dip-and-look qualitative test method is described in detail as well as the reasons behind the need to perform solderability testing to ensure robust and reliable solder joints.
About Hentec Industries
Hentec Industries/RPS Automation is a manufacturer of automated selective soldering, component lead tinning, and solderability test equipment for electronics and electronic component manufacturing, assembly, and distribution. Hentec/RPS has been advancing automated soldering and lead finishing technology for defense, aerospace, automotive, contract manufacturers and micro-electronics component manufacturers since the early 90’s. All Hentec/RPS products are designed and manufactured in Newman Lake, Washington. For more information, please visit us at www.rpsautomation.com.