Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at SMTconnect in Nuremberg, Germany. From 10-12 May, visitors to Saki’s booth 135 in Hall 4A will be invited to see the latest inspection solution upgrades of the company’s 3D-SPI, 3D-AOI and 3D-AXI inspection ranges. The Saki technology team will also present latest hard- and software innovations including Saki’s innovative Z-axis optical head control for 3D-AOI systems alongside its bottom-side 2D-AOI and latest 3D-SPI platform.
With live demonstrations, Saki will offer booth visitors a first-hand look at the unique features of the latest hardware and software releases with an emphasis on reliability, speed, quality, and Smart Factory readiness for applications across all industrial sectors.
< 3D-AOI >
3Di-LS2 with 12μm high resolution Z-axis optical head control feature, and side camera
Saki’s new Z-axis optical-head control feature was developed in response to the increase of customer applications demanding accurate inspection of tall components, press-fit components and PCBAs in jigs. The innovative optical-head offers the industry’s highest level of inspection capability with a height-measurement range in 3D mode up to 40mm. The focus height in 2D is also increased to 40mm. With these capabilities, Saki’s 3Di-AOI Series fulfills inspection capabilities and flexibility far beyond standard SMT inspection processes with accuracy, speed, and ease.
< 3D-CT AXI >
Saki’s compact, lightweight, Inline 3D-CT automated X-ray inspection (AXI) machine for printed circuit board assemblies. The 3Xi-M110 machine, which now comes with new software that reduces cycle time by up to 50%, ensures the quality of hidden solder joints for bottom-electrode packages such as BGAs, LGAs, QFNs, flip-chip, and package-on-package and provides precise volumetric measurements and shape reconstruction to find voids, head-in-pillow, and other defects that are difficult to identify.
< 3D-SPI >
Saki’s high-precision and high-speed 3D solder paste inspection machine. The single-lane system is equipped with a 12µm camera head for board sizes from 50mm×60mm to 500mm×510mm.
< 2D-AOI >
2Di-LU1 (bottom-side 2D-AOI)
The 2Di-LU1 is a 2D-AOI machine of choice for fast, stable and reliable automated inspection of the bottom-side of PCBs. It shares the same software platform as Saki’s 3D-SPI and 3D-AOI solutions. Its proprietary high-speed Line Scan imaging technology ensures the quality of through-hole solder parts after dip, selective, and wave soldering, and improves productivity. Using the same system options as Saki’s SPI and AOI solutions reduces operator workload and running costs.
< Full Line Control Software Solutions >
Saki’s software suite & line control systems demonstrate the company’s data-driven approach to continuous productivity improvement. Visitors to the Saki booth will experience the full IPC-CFX certified machine-to-machine connectivity capability, full line control enabled by Saki’s Offline Teaching station (BF2-Editor), Verification station (BF2-Monitor), Multi Process View and QD Analyzer for advanced Statistical Process Control (SPC).
“Germany has long been regarded as the manufacturing powerhouse of Europe, and, together with our longstanding partner Selecs, we are excited to be back at SMTconnect after the live show had to be cancelled two years in a row due to the global pandemic. We are looking forward to meeting our customers and prospects live and in person to introduce them to our latest inspection solutions,” said Jarda Neuhauser, General Manager of Saki EU.
For more information about Saki visit sakicorp.com/en/.