The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will exhibit at the SMTA Ohio Valley Expo & Tech Forum on Wednesday, August 25th at the Holiday Inn in Strongsville, Ohio.
MacDermid Alpha will promote the ALPHA HiTech portfolio of polymer solutions, as well as its Alpha and Kester low temperature and high reliability solder pastes including the recently released ALPHA CVP-390V.
ALPHA CVP-390V was designed to maximize flexibility in manufacturing and provide excellent electrochemical reliability in harsh operating conditions. “ALPHA CVP-390V is a next generation broad latitude chemistry that delivers consistent print and reflow performance across a wide range of component types and feature sizes”, said Paul Salerno, Global Portfolio Manager. “The compatibility with the Innolot alloy and ability to maintain high electrochemical performance in harsh operating conditions on dense assembly designs makes ALPHA CVP-390V ideal for high reliability applications.”
ALPHA HiTech is a full range of electronics assembly polymer products featuring underfills, edgebonds, encapsulants, and low temperature and SMD adhesives for the Automotive, LED, Consumer Goods and Industrial markets.
Information will also be available on the Metals Reclamation and Recycling program, available from both Alpha and Kester. This initiative recycles scrap solder paste, debris, dross, and other tin-bearing materials from manufacturers throughout North America. Alpha and Kester offer electronics assemblers the safest, most efficient, environmentally-compliant recycling solution that sends no materials to landfills.
For additional information about MacDermid Alpha’s industry-leading assembly products and solutions, please visit MacDermidAlpha.com.