In the webinars in March, the experts from Rehm Thermal Systems will provide theoretical background knowledge on various topics, peppered with insights into the practical application of Rehm’s systems. Take the opportunity to refresh your knowledge, get ideas for innovative projects and gain a comprehensive overview of manufacturing processes in the electronics industry. Further webinars will also take place in the following months, the exact dates will be published in due course.
Registration for all webinars is by e-mail to email@example.com.
04/03/2021 / 9 am CET (Asia, Europe, ROW), 4 pm CET (America, Europe).
Live Webinar: High Temperature Contact Soldering for Semiconductor/Power Electronics with Production LIVE DEMO (English)
Contact soldering with vacuum is best suited for void-free soldering of various components (e.g. IGBT) on DCB substrates. The joining of materials of mostly different materials is done under vacuum at temperatures up to 400 °C. Among other things, the negative pressure helps to minimize oxidation at the components and at the joints themselves. The heat transfer takes place both by thermal conduction and optionally by radiation.
The German-language webinar on this topic will already take place on March 3rd at 9 am CET.
11/03/2021 / 9 am CET (Asia, Europe, ROW), 4 pm CET (America, Europe)
Live-Webinar: Securo / Efficient assembly temperature control for reliable test results (English)
Electronic assemblies in safety-relevant areas of application such as medical technology, the automotive industry and aerospace technology must function 100 % reliably under all temperature conditions. Safe testing and measuring methods are therefore becoming increasingly relevant and are already standard today for analysing the durability of electronic components. In this seminar, our experts will show you how you can simulate precisely these extreme environmental conditions by selectively heating up or cooling down the components with the SecuroPlus/Securo Minus.
The German-language webinar on this topic will already take place on March 10th at 9 am CET.
18/03/2021 / 9 am CET (Asia, Europe, ROW), 4 pm CET (America, Europe)
Live-Webinar: Reduction of voids in solder joints with vacuum (English)
Vacuum soldering has been a proven technique for decades in contact heat and vapor phase soldering systems, significantly reducing gasbubbles in solder joints. What does this mean in terms of convection soldering, though, the most widely used and highest throughput soldering technique today? In our webinar we explain the possibilities of different vacuum soldering processes and also show the corresponding limits.
The German-language webinar on this topic will already take place on March 17th at 9 am CET.
25/03/2021 / 9 am CET (Asia, Europe, ROW), 4 pm CET (America, Europe)
Live-Webinar: Presentation of our Application Center (English)
How can optimal temperature profiles be created? Or what technology can be used to avoid voids in the solder joint? Rehm provides the answers. In our high-tech application and demo centre, customers can test assemblies in direct application of vacuum, condensation or convection soldering processes, create individual temperature profiles and define optimum parameters for the production process with the help of application specialists.
The German-language webinar on this topic will already take place on March 24th at 9 am CET.
About Rehm Thermal System
As a specialist in the field of thermal system solutions for the electronics and photovoltaics industries, Rehm is a technology and innovation leader in the modern and economical production of electronic modules. As a globally operating manufacturer of reflow soldering systems with convection, condensation or vacuum, drying and coating systems, functional test systems, equipment for the metallization of solar cells as well as numerous customer-specific special systems, we are represented in all relevant growth markets and, as a partner with more than 30 years of industry experience, we implement innovative manufacturing solutions that set standards.