Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce the release of the high-reliability TR77000QM SII 3D AOI.
The TR7700QM SII is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry and other high reliability industries.
As the miniaturization of components and PCB boards increases, the demand for resolution inspection increases; TRI inspection platforms have robust metrology capabilities that enable high accuracy and reliability inspection, lowering the false call rates. TRI’s 3D AOI technologies range from Depth from Focus (DFF), 3D Blue Laser, and Moiré projection for virtually Zero-escape Inspection.
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Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements.