Alternative Component Network Expands with Seven New Manufacturing Partners

Alternative Component Network Expands with Seven New Manufacturing Partners

Alternative electronic component distributor, Zel Components, has expanded its partner network with seven new manufacturers, providing engineers and procurement teams greater access to certified,...
Selective PCB potting using the dam-and-fill process protects defined areas of highly integrated automotive PCBs

PCB Potting for Battery Management Systems: How Polyurethanes Ensure Reliable Automotive Electronics

In the highly complex multilayer printed circuit boards (PCBs) used in modern battery management systems, selective potting plays a crucial role in reducing the...
KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

KYZEN to Focus on AI Chip Reliability and Advanced Packaging at SEMICON Taiwan

KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit in Booth I2423 at SEMICON Taiwan from September 2-4, 2026, at TaiNEX...
Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026

Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will participate in the 37th Annual Electronics Packaging Symposium (EPS), September 9-10, 2026,...
Plasmatreat Sets Course for Future Requirements: New Leadership Team Expands Technology Portfolio

Plasmatreat Sets Course for Future Requirements: New Leadership Team Expands Technology Portfolio

With an expanded technology portfolio, Lukas and Magnus Buske and their teams are positioning Plasmatreat to meet future demands in industrial surface treatment. AURORA-Plasma...
Nordson Electronics Solutions introduces the new ASYMTEK Vantage® XL precision fluid dispensing system for panel-level packaging (PLP) during semiconductor manufacturing at SEMICON Taiwan 2026.

Nordson Electronics Solutions launches the new ASYMTEK Vantage® XL fluid dispensing system for panel-level...

Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, introduces the new ASYMTEK Vantage® XL fluid dispensing platform, designed specifically to address...
WEISUN - FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

WEISUN – FOPLP Curing and Annealing Oven Adds Dedicated 310mm Chamber Configuration

Taiwanese thermal processing equipment maker WEISUN Industrial Co., Ltd. has added a dedicated 310 x 310mm configuration to its AQWOL-5S Smart Clean Room and...
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North American EMS Orders Surge in July as Book-to-Bill Stands at 1.29

The Global Electronics Association announced today the July 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands...
BTU International Introduces Aurora Vacuum™ Reflow Oven for High-Volume, High-Yield Electronics Manufacturing

BTU International Introduces Aurora Vacuum™ Reflow Oven for High-Volume, High-Yield Electronics Manufacturing

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced the launch of the Aurora Vacuum™...
TRI at the IPC CFX Smart Factory Demo Line at FBC ASEAN 2026

TRI at the IPC CFX Smart Factory Demo Line at FBC ASEAN 2026

Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will participate as a key technology partner in...