IPC announced today the February 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.22.
Total North American...
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced packaging. In this newly...
IPC has announced the expansion of its complimentary training offerings for IPC members with the introduction of a “Foreign Object Debris (FOD) for Electronics...
Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, to announce its participation in the 2024 IPC APEX EXPO, scheduled...
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its receipt of recognition for 25...
Registration is now open for Electrical Wire Processing Technology Expo (EWPTE) an exclusive, free-of-charge* event for the electrical wire harness, wire, coil winding and...
The increasing complexity of electronics manufacturing requires embracing data analytics to manage electronics factories, according to a new white paper from IPC’s Chief Technologist...
IPC announced today the January 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.93.
Total North...
Sentiment among electronics manufacturers remains positive, despite minor setbacks during January, according to IPC’s February Sentiment of the Global Electronics Manufacturing Supply Chain Report.
When...