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ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications...
ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the launch...
Circuit Technology Center to Increase Component Level Modification Services Capacity
Hentec Industries/RPS Automation is pleased to announce that the Circuit Technology Center has issued a purchase order for two additional Hentec/RPS Odyssey 1325 robotic...
Essemtec Joins Forces with Restronics in Florida
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it has hired Restronics as its new manufacturers‘ representative in...
Dorset CEM Boosts Surface Mount Capacity with Specialist Rapid Productivity Solutions
Long-term Europlacer customer Electronics Technicians Ltd (ETL), located just 10 miles from Europlacer’s UK HQ, has embarked on a broad modernisation investment programme at...
ITW EAE German Office moved to Alzenau
ITW EAE has moved its Germany Sales and customer support offices from Dreieich to Alzenau. The new office located at Building 7, Industriestraße 13,...
Murray Percival Co. Brings SCHUNK Depaneling to Amphenol Borisch
The Murray Percival Company, the leading supplier to the Midwest's electronics industry, today announced the sale of a SCHUNK SAR 1300 BD2 depaneling machine...
Koh Young America is Proudly Sponsoring the Mid-Atlantic SMTA Virtual Learning Event on Failure...
Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is excited to be a corporate sponsor at the upcoming four-day virtual SMTA chapter...
Transition Automation to Exhibit at SMTA Ohio Valley Expo & Tech Forum
Transition Automation, Inc. announces that it will exhibit a complete display of Permalex Long Life Metal Squeegees and Advanced Holder Systems in Booth #12...
High Volume division makes acquisition in China
Mycronic’s Assembly Solutions High Volume division has signed an agreement to acquire Shenzhen Huan Cheng Xin Precision Manufacture Co., Ltd., a company with around...
Saki’s 3Si SPI and 3Di AOI Series Awarded IPC-CFX Certification
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces that the 3Si Solder Paste Inspection (SPI) and 3Di...
