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ByteSnap Design releases strategic guide to production-ready Bill of Materials management, complementing recent OMaaS launch
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November 25, 2025
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Posts by Wendy Tindle
Wendy Tindle
1676 POSTS
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ZESTRON South Asia Announces Change of Management
Wendy Tindle
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February 6, 2024
Yamaha Robotics Releases 3D Hybrid AOI System – YRi-V TypeHS
Wendy Tindle
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February 6, 2024
Saki to Highlight Advanced Inspection Innovation at Smart SMT & PCB...
Wendy Tindle
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January 31, 2024
ITW EAE patented Auto Exit Wing Feature for Electrovert® Wave Soldering...
Wendy Tindle
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January 16, 2024
Cetec ERP to Revolutionize Manufacturing Efficiency at Design 2 Part Show...
Wendy Tindle
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December 14, 2023
PVA Unveils State-of-the-Art Applications Lab in Guadalajara, Mexico
Wendy Tindle
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December 14, 2023
AIM Solder’s New NC259FPA Ultrafine No Clean Solder Paste Wins MiniLED...
Wendy Tindle
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December 14, 2023
DKSH Enters New Partnership with Essemtec across Asia Pacific
Wendy Tindle
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December 14, 2023
South-Tek Systems Recognizes Don Ernst of BarTron, Inc. with Top Project...
Wendy Tindle
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December 13, 2023
Wafer-Level Packaging Symposium Program Announced
Wendy Tindle
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December 13, 2023
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