Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a range of high-reliability, AI-enabling advanced materials at the International Conference for High Performance Computing, Networking, Storage, and Analysis (SC26), November 17-19, in Chicago, Illinois.
The company will feature the following products:
- Solder Thermal Interface Materials (sTIMs) deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, sTIMs enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, sTIMs enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting sustainability initiatives.
- Heat-Spring® is a compressible, non-reflow metal thermal interface material (TIM) ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86 W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems and offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
- GalliTHERM® is a portfolio of gallium-based liquid metal solutions built on more than 60 years of expertise in manufacturing advanced gallium materials. Designed for both TIM1 and TIM2 applications, these liquid metal TIMs offer cutting-edge thermal interface performance with superior reliability.
To learn more about Indium Corporation’s extensive thermal management portfolio, visit indium.com or meet company experts at SC26 Booth 6707.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Mexico, Singapore, South Korea, the United Kingdom, and the U.S.
