ASMPT Semiconductor Solutions will present technologies for modern power electronics and semiconductor manufacturing at PCIM Expo 2026, taking place in Nuremberg from June 9 to 11. Under the theme “Empower the Intelligence Revolution,” the company will showcase solutions for silver sintering, laser dicing and grooving, and multi-chip bonding at Booth 339 in Hall 6, with a focus on smart mobility.
As modern vehicles become increasingly electrified and digitalized, the requirements for power density, thermal management, reliability, and integration density of electronic systems continue to rise. ASMPT addresses these challenges with technologies for key process steps in semiconductor manufacturing and packaging.
Exclusive Oxidation-Free Vacuum Sintering Solution
SilverSAM PRO, a silver sintering platform for the production of highly reliable power module packages, will be presented for the first time. The solution offers an oxidation-free, copper-friendly process environment as well as a new temperature control system for power-box sintering, meaning the sintering of molded packages onto heat sinks. SilverSAM PRO supports scalable production configurations with 1 to 4 presses and processes various substrate formats, ranging from DBC / AMB panels and singulated DBC / AMB substrates to wafer-level and leadframe-based power discrete applications. Thanks to their high electrical and thermal conductivity, sintered silver interconnects are particularly well suited for power modules used in electric drivetrains and fast-charging infrastructure.
Laser Dicing and Grooving for Advanced Packaging
With the ALSI LASER1206, ASMPT presents a platform for the singulation of bare wafers under Class 1000 cleanroom conditions. The laser dicing and grooving solution combines multi-beam technology with fully automated handling of film-framed and bare wafers. The
patented UV laser technology enables maximum precision with minimal heat input, thereby reducing burr formation and thermal stress on the die. The platform is suited for advanced packaging applications in automotive power electronics as well as for AI and mobile applications.
Automatic High-Precision Multi-Chip Bonder
The MEGA multi-chip bonder supports a broad range of multi-chip packages with its modular architecture. The platform provides high-precision die bonding technology for compact high-end electronics and supports stable processes with consistent process quality. MEGA processes large-format substrates up to 280 × 300 mm and combines speed, flexibility, and high placement accuracy. The platform is suited for MCM, SiP, and flip-chip applications for the production of compact computing modules.
Semiconductor Packaging Innovations for Smart Mobility
“Power electronics, electric drivetrains, advanced driver assistance systems, and connected vehicle platforms are placing increasingly demanding requirements on power density, thermal management, and compact form factors in the automotive sector. We provide cutting-edge technologies for advanced packaging and semiconductor manufacturing that drive innovation in artificial intelligence, smart mobility, and hyperconnectivity,” says Dr. Johann Weinhändler, Regional Head ASMPT Semiconductor Solutions Europe and Managing Director of ASMPT AMICRA in Regensburg, describing the company’s strategy.
To learn more, visit asmpt.com.
