What if your solder paste, your cleaning process, and your inspection strategy weren’t treated as separate conversations—but as one connected system?
KOKI Solder America is answering that question with the launch of its 2026 Webinar Series—a year-long initiative designed to deliver practical, data-driven insight across the full SMT process.
The series brings together KOKI’s material science expertise with leading partners, including ZESTRON and Koh Young Technology, to address real manufacturing challenges through a more integrated approach.
A More Connected Way to Solve Process Challenges
Too often, process issues are approached in silos—materials, cleaning, and inspection are treated independently. KOKI’s 2026 Webinar Series challenges that mindset.
From flux chemistry and cleanability to stencil printing performance and defect prevention, the series delivers actionable guidance backed by analytical testing, real production data, and hands-on engineering experience.
Featured 2026 Sessions
When Cleaning Gets Hard: Solving Low-Standoff Challenges with Advanced No-Clean Solder Pastes
Tuesday, May 12 | 10:00 PT | 12:00 CT | 1:00 ET
Presenters: Shantanu Joshi, KOKI Solder America & Jigar Patel, ZESTRON Corporation
A technical deep dive into how engineered low-residue solder pastes and optimized cleaning processes work together to improve under-component cleanliness, reduce process aggressiveness, and maintain reliability.
Using SPI Data to Evaluate Solder Paste Printability Over Extended Stencil Cleaning Intervals
Thursday, June 4 | 10:00 PT | 12:00 CT | 1:00 ET
Speakers: Shantanu Joshi, KOKI Solder America & Ray Welch, Koh Young
This session explores how solder paste inspection (SPI) data can be used to quantify print performance over extended cleaning intervals—demonstrating how manufacturers can reduce downtime and improve throughput while maintaining consistent print quality.
Understanding and Preventing Dewetting Defects in SMT Soldering
Tuesday, September 15 | 10:00 PT | 12:00 CT | 1:00 ET
Presenter: Jerome McIntyre, KOKI Solder America
Drawing from KOKI’s extensive defect analysis database, this webinar examines the root causes of dewetting—one of the most common SMT defects—and provides proven strategies to improve yield and long-term reliability.
Built for Engineers. Backed by Data.
KOKI’s 2026 Webinar Series is designed for engineers, process owners, and manufacturing leaders seeking more than theory. Each session focuses on:
- Real-world testing and validation
- Data-driven process optimization
- Practical strategies that can be implemented immediately
By combining materials expertise with collaborative partnerships, KOKI continues to position itself not just as a supplier but as an extension of its customers’ engineering teams.
Register for the 2026 Webinar Series: www.koki-global.zoholandingpage.com/2026WebinarSeries
