Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will discuss how data-driven transparency supports manufacturing resilience in electronics manufacturing at the EPP InnovationsFORUM+ 2026, scheduled for April 15, 2026, at the Böblingen Congress Hall in, Germany. The event brings together experts from across the electronics manufacturing ecosystem to explore innovations in automation, artificial intelligence (AI), sustainability, and smart manufacturing.
As part of the conference program, Axel Lindloff of Koh Young Europe will present “From Quality to Resilience: How Data-Driven Transparency Ensures Delivery Capability,” examining how greater transparency across the SMT process helps manufacturers respond more effectively to disruption and variability.
Resilience describes the ability to deal with internal and external stressors without escalating. Only upon closer inspection does it become clear that the same principle applies to manufacturing. Only the stressors have different names.
In production environments, stressors arise from fluctuating delivery quality, new materials, inexperienced employees, or unstable processes. When these factors come together, the system escalates. The result is scrap, downtime, delays, and hectic decisions. Not because individual factors are wrong, but because there is a lack of overview.
Resilience does not arise in people or in manufacturing by suppressing individual voices. It arises through transparency. In production, this means above all data transparency across the entire process.
SMT lines generate enormous amounts of data. However, it is not the quantity that is decisive, but the context. Consistent 3D measurement technology during printing, assembly, and soldering provides quality-relevant measurements along the entire line. In combination with AI-driven analytics, deviations can be detected at an early stage, processes monitored, and root causes more precisely identified.
“Manufacturers today face growing variability, whether from materials, supply chains, workforce changes, or evolving product complexity,” said Axel Lindloff of Koh Young Europe. “True 3D measurement data across the SMT process provides the transparency needed to detect issues early, stabilize production, and maintain delivery capability even as conditions change.”
Beyond individual inspection points, manufacturers increasingly benefit from connecting measurement data across the production line. Koh Young’s software and smart factory solutions help contextualize inspection results, enabling manufacturers to analyze trends, identify process interactions, and respond more quickly to emerging deviations. By transforming measurement data into actionable insights, manufacturers gain the transparency needed to maintain stable, predictable production.
Koh Young’s True 3D SMT inspection and metrology solutions provide consistent, objective process data across key manufacturing steps, including solder paste printing, component placement, and reflow soldering. Unlike approaches that infer process conditions from image-based inspection alone, Koh Young’s measurement-based technology delivers accurate height and volume data that manufacturers can use to better understand process variation and implement meaningful process control. By converting inspection data into actionable insights, manufacturers can prevent defects, optimize processes, and increase throughput. This data-driven approach also supports more resilient production operations.
The EPP InnovationsFORUM+ 2026 focuses on six key themes shaping the future of electronics production, including AI and digitization, automation, sustainability, and smart manufacturing. The forum provides a platform for industry experts to exchange ideas and explore technologies that support more efficient and transparent production environments.
For additional event information and registration, visit: https://epp.industrie.de/innovationsforum-deutschland/
