Heraeus Electronics will exhibit at the 2026 APEX EXPO at the Anaheim Convention Center, Booth 1730, where the company will showcase a broad portfolio of assembly materials focused on power module and advanced electronics applications.
At this year’s show, Heraeus Electronics will display a range of soldering, sintering, and preform solutions, emphasizing material choices that allow manufacturers to balance performance, reliability, and cost. Products on display will include Microbond® SMT660 Innolot®, SMT650 SAC305, mAgic® PE338 die-attach materials, mAgic®PE360 sintering paste, and Microbond® solder preforms.
A key theme of the Heraeus Electronics exhibit will be module attach, with side-by-side material options for different product priorities. For applications requiring the highest thermal and mechanical performance, Heraeus will highlight large-area silver sintering using mAgic® PE360. For manufacturers seeking a lower-cost alternative while maintaining strong reliability, Heraeus will feature its Microbond® solder preforms based on Innolot® and Innolot® 2.0 alloys.
The mAgic® PE360 sintering material has set a new benchmark for large-area module attachment by delivering uniform bond lines, void-free, and highly reliable thermal paths. Unlike traditional sintering materials that require high pressure and complex handling, PE360 sinters at relatively low pressure and temperature. Available in both printing (PE360P) and dispensing (PE361D) formats, the material supports flexible process integration across a range of assembly environments.
Heraeus will also spotlight its Microbond® solder preforms portfolio, including Innolot® and Innolot® 2.0. These preforms are designed for module-to-heatsink attachment and address common challenges associated with conventional SAC and SnSb alloys, such as limited thermomechanical stability and high silver content. Innolot® offers lower processing temperatures for thermally sensitive assemblies, while Innolot® 2.0 provides material cost savings through reduced silver content without sacrificing durability under thermal cycling.
Additional materials on display will include Microbond® SMT660 Innolot® no-clean solder paste, engineered for high-reliability applications where creep resistance, low voiding, and reduced defect rates are critical. The paste performs in air without nitrogen, helping manufacturers control total cost of ownership while meeting demanding reliability requirements.
Making the Right Choice: Performance vs. Cost
A key takeaway from Heraeus Electronics’ recent webinar on “Sintering vs. Soldering” is the importance of evaluating trade-offs between performance and cost. For next-generation EV power modules, high-performance sintering with PE360 offers superior thermal conductivity and long-term durability, particularly under extreme thermal cycling. In contrast, Innolot® solder preforms provide a cost-effective solution with simpler processing while still delivering reliable performance for many applications. By considering the specific demands of each module—such as thermal load, mechanical stress, and production budget—engineers can make informed decisions that optimize both efficiency and cost-effectiveness.
Visitors to Booth 1730 will have the opportunity to discuss material selection strategies for power electronics, automotive, industrial, and energy applications, and to compare soldering versus sintering approaches based on performance needs and cost targets.
For more information about Heraeus Electronics and its assembly material solutions, visit www.heraeus-electronics.com.
