Keiron Technologies, the Eindhoven-based pioneer in digital solder paste precision printing, will exhibit at the 2026 APEX EXPO, taking place March 17–19 at the Anaheim Convention Center. Attendees are invited to visit Booth 642 to learn more about Keiron’s LiFT (Laser-Induced Forward Transfer) technology and the company’s latest innovation, the Keiron HF2 LiFT Printer, a fully digital, contactless solder paste printing system designed for today’s high-mix and miniaturized electronics manufacturing.
Keiron’s LiFT technology replaces traditional stencil- and nozzle-based paste deposition with a laser-driven, non-contact process that digitally transfers standard solder paste with high precision. By eliminating stencils, nozzles, ejectors, and mechanical contact points, LiFT streamlines production while addressing one of the primary sources of SMT defects: inconsistent solder paste application.
At APEX 2026, Keiron will highlight the HF2 LiFT Printer, which enables accurate, repeatable solder paste deposition down to nanoliter volumes. The system works with standard solder pastes and accepts common CAD, Gerber, and ODB++ files, allowing manufacturers to adopt digital printing without changing materials or reworking existing workflows. With no stencils to fabricate, clean, or store, changeovers can be completed in minutes rather than hours—making the HF2 printer especially well suited for high-mix, NPI-driven production.
A key differentiator of the HF2 printer is its integrated Solder Paste Volume Metrology (SPVM), which measures every deposit during the printing process. This approach provides immediate process verification without the need for a separate SPI system, improving first-pass yield and reducing rework and scrap. The contactless architecture also avoids common reliability issues associated with clogging, wear, and alignment drift found in traditional printing technologies.
“The HF2 fundamentally changes how manufacturers think about solder paste deposition,” said Paul Rooimans, CEO, Keiron Technologies. “By moving to a fully digital, laser-based process, manufacturers gain precise control over every deposit while eliminating many of the consumables, setup steps, and failure points that limit traditional printing.”
Visitors to Booth 642 will have the opportunity to learn how LiFT technology supports ultra-fine pitch assemblies, advanced packaging, and applications requiring rapid changeover and tight process control—all while reducing operating costs and simplifying day-to-day production.
For more information about Keiron and its LiFT-based solder paste printing solutions, visit www.keirontechnologies.com or stop by Booth 642 at APEX EXPO 2026. You can leave your request for a demo of the HF2 printer during the show here: www.keirontechnologies.com/apex-expo-2026
