Essemtec, the Swiss technology leader in advanced electronics manufacturing solutions, will exhibit at APEX EXPO 2026, North America’s premier electronics industry event, taking place March 17–19, 2026, in Anaheim, California, at Booth 3629. Visitors will experience live demonstrations of Essemtec’s latest innovations, including the FOX Ultra All-in-One, PUMA Ultra All-in-One, the Tarantula, as well as a world premiere in dispensing technology.
Experience High-Speed, High-Precision Solder Paste Jetting
At APEX, Essemtec will demonstrate solder paste jetting at speeds of up to 1.1 million dots per hour, showcasing unprecedented performance for fine-pitch and high-density applications. Solder paste jetting delivers tangible benefits to electronics manufacturers, including faster setup times, reduced waste, and the flexibility to handle complex, mixed-technology boards—enabling increased throughput while maintaining uncompromising quality. Solder paste jetting can complement traditional stencil printing or fully replace it. Demonstrations will be performed using both leaded and lead-free solder pastes.
All-in-One Solutions for PoP and SiP Applications
The FOX Ultra and PUMA Ultra All-in-One platforms highlight Essemtec’s commitment to supporting the growing demand for Package-on-Package (PoP) and System-in-Package (SiP) assembly. These versatile solutions combine dispensing, jetting, placement, and inspection within a single integrated platform, enabling manufacturers to manage high-mix production efficiently and with exceptional precision.
Unmatched Dispensing and Jetting Capabilities
The world premiere at APEX will unveil the latest advancement in Essemtec’s dispensing technology, demonstrating the company’s ability to dispense almost any type of fluid with outstanding accuracy, repeatability, and precision. Visitors are invited to explore the full range of Essemtec’s dispensing and jetting capabilities, from microdots and high-viscosity materials to advanced underfill and adhesive applications.
Meet the Experts
Attendees will have the opportunity to meet Essemtec’s North American and European teams, discuss production challenges, and discover solutions tailored to modern electronics manufacturing requirements.
Join Essemtec at Booth 3629 to experience live demonstrations and learn how integrated All-in-One platforms and advanced dispensing solutions can transform production capabilities.
About Essemtec
Founded in 1991, Essemtec is a Swiss technology company delivering innovative electronics manufacturing solutions worldwide. Specializing in high-precision pick-and-place, dispensing, solder paste jetting, reflow, and curing, Essemtec provides scalable and upgradeable solutions designed to improve efficiency, precision, and sustainability in modern production environments.
