Essemtec, a global leader in adaptive, highly flexible surface mount technology (SMT) solutions, is proud to announce that its Tarantula Dual Lane dispensing & Jetting platform has won a 2025 Global Technology Award in the Dispensing Equipment category. The award was presented during a ceremony at productronica 2025 in Munich, Germany, on Tuesday, November 18, recognizing Essemtec’s advanced dispensing & Jetting technologies for high-volume, high-mix production environments.
The Tarantula Dual Lane is Essemtec’s most advanced dispensing platform to date, designed to combine speed, precision, and versatility in a single compact footprint. With its dual-lane architecture, the system enables independent processing on two lanes simultaneously, delivering significant productivity gains without increasing floor space.
“Winning this award at productronica is a true honor,” said Pierre-Jean Cancalon, Head of Marketing & Communications at Essemtec. “The Tarantula Dual Lane was engineered to give manufacturers the highest level of flexibility for high speed line, while maintaining the exceptional quality and versatility Essemtec is known for.”
The platform features next-generation control technology for faster, more precise jetting and dispensing, supporting real-world performance of 350,000 dots per hour in average with Jet-on-the-Fly solder paste jetting and a maximum frequency of 1’100’000 dots per hour. Its ability to integrate up to three dispensing valves in one system allows manufacturers to combine multiple processes—such as solder paste jetting, glue or epoxy jetting, and contact dispensing—without additional equipment.
Beyond performance, the Tarantula Dual Lane is designed to maximize production quality with optional 2D solder paste inspection (SPI) and auto-correction, integrated traceability, and a holistic approach to process control. These features help improve first-pass yield, reduce rework, and enhance overall process stability.
Manufacturers also benefit from reduced costs and lower environmental impact. The Tarantula Dual Lane minimizes material waste by jetting the exact amount required, eliminates the need for stencil cleaning chemicals, and reduces overall line complexity by replacing multiple machines with one. The Tarantula Dual Lane could also work in complement of a traditional screen by eliminating stepped stencil designs, applying solder exactly where needed in cavities for example or for ultra-fine pitch and special components.
Ease of use remains a hallmark of Essemtec platforms. The Tarantula Dual Lane leverages Essemtec’s intuitive ePlace software, optimized job preparation tools, and compatibility with EasyLogix PCB-Investigator, making setup faster and more efficient. Its modular design, software upgrade options, and remote diagnostics ensure a long lifecycle and protect manufacturers’ investment. The IPC Hermes and CFX are also supported to ensure a seamless integration into any factory environment.
With its winning combination of scalability, precision, and sustainability, the Tarantula Dual Lane sets a new standard for dispensing and Jetting equipment in high-volume electronics manufacturing.
3 Valves. 2 Lanes. 1 Smarter Solution.
Tarantula Dual Lane – Endless Versatility in Dispensing & Jetting
About Essemtec
Essemtec is renowned for its adaptive, highly flexible SMT pick-and-place equipment, sophisticated dispensers suitable for both high-speed and micro-dispensing, and intelligent production material storage and logistic systems. All products are equipped with advanced software packages, ensuring efficient material management and user-friendly operation. Essemtec’s solutions are implemented worldwide across various industries, reflecting the company’s commitment to quality and innovation.
