MIRTEC, the ‘Global Leader in Inspection Technology’, pleased to announce its participation in the SMTA Guadalajara 2025, taking place September 17–18, 2025 at Expo Guadalajara, Mexico. During the event, MIRTEC will showcase its full portfolio of advanced 3D AOI, SPI, and Smart Factory Automation solutions—specifically designed to meet the demanding inspection requirements of the electronics manufacturing industry. Attendees are invited to visit MIRTEC’s booth 302 and experience first-hand the company’s commitment to innovation, quality, and productivity.
Key Inspection Systems on Display:
ART
MIRTEC’s flagship Anti-Reflection Technology (ART) 3D AOI System is the world’s first 75MP Multi-Camera / Full HD 12 Projection inspection platform. It combines five 15MP CoaXPress color cameras with proprietary Moiré projection to deliver reliable inspection of reflective objects, such as solder joints in automotive, aerospace, and defense applications. ART was recently honored with the Productronica Innovation Award 2023 and Global Technology Award 2024, further cementing its status as the most advanced AOI system on the market.
GENESYS-CC
A high-resolution Conformal Coating AOI featuring a 15MP camera, 15μm lens, and tri-stage UV lighting including coaxial lighting. With optional 4μm optics, it detects 30μm bubbles with exceptional accuracy. A side camera enhances lateral coating inspection, and an internal flipper enables double-sided PCB inspection. It supports coating thickness measurement from 10μm to 1,000μm.
TAL 3D SCAN
This pre-inspection laser module enables 3D measurement of components up to 70mm tall without Z-axis movement. It integrates seamlessly with the MV-6 OMNI and improves productivity by up to 30% for THT–SMT mixed assemblies without compromising speed.
MV-6 OMNI
MIRTEC’s award-winning inline 3D AOI system is configured with a 15MP CoaXPress main camera, four 18MP side cameras, and Digital Blue Moiré Projection. It offers Z-axis movement to inspect components up to 40mm in height and can optionally include a built-in flipper for dual-sided PCB inspection. SPI functionality is also supported.
MV-3 OMNI
A compact benchtop 3D AOI system sharing the same hardware and software as MIRTEC’s inline models. It supports 70mm top and 100mm bottom clearance, ideal for high-clearance components in automotive or defense electronics. Features Tri-Frequency Moiré Projection and Z-axis adjustability.
MS-11
MIRTEC’s 3D SPI System supports 15MP or 25MP CoaXPress cameras and dual projection moiré imaging. It inspects solder paste deposits for volume, shape, bridging, and more. Fully IPC CFX compliant, it enables closed-loop feedback and SPI–AOI linkage via MIRTEC’s Quick Tracker interface.
GENESYS-AUTO
Developed specifically for the automotive electronics sector, this next-generation 3D AOI integrates a 12MP CoaXPress camera, 15μm telecentric lens, 9-phase RGB lighting, and four programmable projectors. It inspects tall connector pins up to 50mm and supports both Precision Mode and High-Speed Mode, optimizing for either accuracy or throughput depending on the application.
TRMS
MIRTEC’s Total Remote Management System is an Industry 4.0-ready platform offering real-time monitoring of equipment health, yield, operation time, environmental factors, and more. When used with MIRTEC’s inspection systems, TRMS dramatically improves process visibility and responsiveness in high-volume SMT lines.
Commitment to Smart Manufacturing
MIRTEC continues to lead innovation across AOI, SPI, and Smart Factory domains with a focus on AI, high-precision optics, and productivity enhancement. With a robust footprint in Latin America, MIRTEC invites visitors to Booth 302 to discover how its total inspection solutions can elevate manufacturing performance in real-world production.
To learn more, visit www.mirtec.com
