SHENMAO America, Inc. is proud to announce the release of its PF925-P250 No-Clean Zero-Halogen Lead-Free Solder Paste. Developed to meet the demands of high-reliability applications, PF925-P250 delivers exceptional performance and enhanced durability.
The PF925-P250 was developed to address the need for high-reliability solder solutions in demanding applications. The PF925 alloy (Sn-Ag-Cu-In-Bi), patented by Panasonic, is specifically designed to enhance reliability. The inclusion of Indium (In) and Bismuth (Bi) in the solder matrix forms a solid solution in the Sn matrix, significantly increasing strength and reliability compared to traditional SAC solders. With better thermal stress resistance and the ability to prevent cracks in solder joints, PF925-P250 ensures durability even under extreme conditions. Furthermore, its lower melting point compared to SAC solders adds to its versatility and application range.
The PF925-P250 solder paste stands out with its halogen-free (ROL0) composition, containing no intentionally added halogens. Fully compliant with RoHS, RoHS 2.0, and REACH regulations, this innovative solder paste meets stringent environmental and safety standards. Its specially formulated flux offers superior low-voiding performance, particularly with challenging components such as BGAs, QFNs, and MOS devices that require large ground pad contact. In addition, the solder paste delivers excellent solderability and exceptional wettability, ensuring reliable and consistent performance across the board.
This advanced solder paste is ideal for products that utilize the Surface Mount Technology (SMT) process and require high reliability. Its robust features and exceptional performance make it a perfect solution for industries such as automotive, aerospace, consumer electronics, and other sectors where precision and durability are critical.
For more information about SHENMAO’s PF925-P250 solder paste and other advanced solder materials, visit www.shenmao.com.
