Introduced at the SMTA International 2024 Conference in Rosemont, IL.
Design Guidelines for Surface Mount and Microelectronic Technology
A comprehensive guide developed for printed circuit board (PCB) design engineers focusing on:
- SMT Assembly Processing
- SMT Land Pattern Development
- DFM for HDI and U-HDI Circuit Boards
- Flexible and Rigid-Flex Circuits
- Advanced Semiconductor Package Technologies
- 2D, 2.5D, 3D and Hybrid Bond Interconnect
The book was written for the circuit board design specialist furnishing proven methods and techniques needed for developing a reliable and assembly process-compatible product. The text and illustrations provided in this book were written by a designer for designers, emphasizing why today’s design professional must be cognizant of the relationship between printed circuit board design, circuit board manufacturing, and circuit board assembly processing. Readers will find that the detailed information is useful to several disciplines, including product design specialists, material procurement professionals, and those responsible for manufacturing, assembly and product testing.
Key issues include the development of process-compliant land pattern geometry, selecting suitable circuit board base materials, and specifying surface finishes that is most compatible with the termination process selected for assembly.
Circuit board designers are often tasked with developing what could potentially evolve to become a very high-volume SMT product but have only a limited knowledge of the assembly methodology or alternative attachment procedures. Because many designers are not commonly working within the manufacturing environment and may lack the resources for guidance in preparing the circuit board for high-volume assembly automation.
The success of any design will be dependent upon meeting the criteria for assembly process efficiency and end-product reliability.
To review content and order Design Guidelines for Surface Mount and Microelectronic Technology, visit www.solbergtech.com.
