KIC, the leader in smart thermal process technologies for electronics manufacturing, is pleased to announce that Miles Moreau, General Manager, will be presenting at SMTA International 2024. The presentation, titled “Thermocouple Tactics: A Comparative Study of Attachment Methods,” will take place on Wednesday, October 23 from 2-3:30 p.m. during Session RHE6 of the Reliability and Harsh Environments track at the Donald E. Stephens Convention Center in Rosemont, IL.
This session will explore various thermocouple attachment techniques for PCB thermal profiling, a critical aspect of ensuring high-quality printed circuit board (PCB) assembly. Accurate monitoring and control of the time-temperature profile during reflow soldering are essential for maintaining product integrity and minimizing rework and scrap. However, the accuracy of temperature measurements is highly dependent on the method used to attach thermocouples to the PCB assembly.
Miles Moreau, alongside Chrys Shea of Shea Engineering and Martin Anselm of Rochester Institute of Technology (RIT), will present findings from a series of experiments designed to evaluate different methods of affixing thermocouples to circuit boards. The study, conducted at RIT, involved testing various attachment techniques, including polyimide tape, aluminum tape, high-temperature solder, and thermally conductive adhesives, on SMTA test boards subjected to multiple reflow cycles.
“We’re excited to share the results of our comprehensive study on thermocouple attachment methods,” said Miles Moreau. “This research is vital for the industry as it highlights the impact of attachment techniques on the accuracy of temperature measurements, ultimately contributing to higher-quality PCB assemblies.”
The presentation will provide detailed insights into the test methods, statistical analysis, and conclusions drawn from the study, offering valuable guidance for manufacturers looking to optimize their thermal profiling processes.
For more information about KIC, visit www.kicthermal.com.
