Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join electronica 2024, which will be held at Messe München Center from November 12 – 15, 2024. Visit booth No. A3-638 to experience TRI’s newly released test and inspection solutions.
TRI’s Bottom Side View 3D AOI, the TR7700QB SII, will make its debut at electronica 2024. The TR7700QB SII is powered by TRI’s Smart Programming, AI Algorithms, and Metrology measurement capabilities. The PIN Inspection for the automotive industry measures the Pin Height, Pin alignment, straightness, and distance measurements with metrology. The TR7700QB SII’s THT Solder Algorithms support the IPC-A-610H criteria.
Also featured will be the Conformal Coating AOI, TR7700 SIII Ultra CI, with improved optical design and specialized multi-phase lighting for detecting coating issues, which can measure coating thickness and inspect dispensed flux and glue. Also exhibiting will be the newly released high throughput 3D AXI, TR7600LL SV, which offers up to 20% performance improvement compared to the award-winning TR7600 series.
TRI’s lineup will also include the enhanced 3D SPI TR7007Q SII, the high-speed multi-angle 3D AOI, TR7500QE Plus, and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE. TRI’s AI Inspection solutions include AI Smart Programming, AI Repair Station, Training Tools, AI Station, and more. TRI Test and Inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Don’t miss the opportunity to discuss with our experts how TRI solutions can enhance your production yield rate, reduce operational costs, and increase efficiency.
To learn more, visit www.tri.com.tw.
