Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2026, booth 3601 (Hall N2), in the Shanghai New International Expo Centre, March 25-27, 2026.

  • The ASYMTEK Vantage® fluid dispensing system is popular for wafer-level and panel-level packaging dispensing applications, such as precise, fine lines for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly. A new cleanroom configuration for the Vantage system will be previewed in the booth. It is designed to meet Class-100 standards for customers who require cleanroom-compatible operations for advanced packaging.
  • The MARCH FlexTRAK® plasma system in its stand-alone configuration will also be exhibited in the booth. This versatile plasma system delivers high-throughput surface treatment in a slim footprint to process components for semiconductor manufacturing. Flexible plasma chamber configurations support contamination removal, etching, and surface activation before die attach, wire bond, molding and encapsulation, and underfill applications.
  • Experts will be ready to answer questions, discuss industry trends, and help navigate the challenges of advanced semiconductor packaging to meet the needs of today’s fast-paced innovations.

Productronica China will be held at the same time, March 25-27, in the same exhibition center in Shanghai. Several things to note:

  • Nordson Electronics Solutions will participate in the Electronic Intelligent Manufacturing Forum technical conference. Kahn Huang, application manager, Nordson Electronics Solutions, China, will speak on the topic, “Nordson Empowers AI Smart Factories and Effectively Improves Process Reliability”.
  • In addition, two partners will exhibit Nordson Electronics Solutions equipment in Hall E4:

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