Kurtz Ersa Inc., a leading supplier of electronics production equipment, will exhibit at the 2026 IPC APEX EXPO, March 17–19 at the Anaheim Convention Center in Anaheim, California. Attendees are invited to visit Booth 2113 to see the latest additions to Ersa’s portfolio of reflow, selective soldering, rework, and connected soldering solutions—many of which will be shown publicly for the first time.
On display will be the HOTFLOW THREE reflow oven (16-zone configuration), along with several new and updated selective soldering platforms, including the VERSAFLOW FIVE, VERSAFLOW 4 Core. Ersa will also demonstrate the HR 600 XL rework system with its newly introduced heating head, as well as the i-CON TRACE soldering station, now with IPC CFX certification for connected factory environments.
A highlight of Ersa’s APEX EXPO presence is the VERSAFLOW FIVE, which introduces a new approach to selective soldering focused on higher output and reduced line complexity. At the heart of the system is the new VERSAFLEX 2.0 solder module, which allows two PCBs to be processed independently within a single machine. This parallel processing capability increases throughput without requiring additional equipment or floor space. Features such as automatic solder nozzle changing and matrix-controlled preheating help address common setup, consistency, and repeatability challenges—particularly in high-mix, high-volume production environments.
Also on display, the HOTFLOW THREE reflow oven features Ersa’s SCPU® (Smart Convection Power Unit), delivering precise thermal control with significantly reduced nitrogen consumption. Designed for stable profiling and strong repeatability, HOTFLOW THREE supports modern connectivity requirements while helping manufacturers balance process performance with operating efficiency.
Rounding out the exhibit is the HR 600 XL rework system, now equipped with a new heating head designed for large-format and high-density assemblies. The system supports precise, controlled rework of BGAs, QFNs, connectors, and other complex components, with vision-assisted alignment and intelligent process control ensuring consistent results—even on sensitive and densely populated boards.
Also featured is the SRO i-LINE, a high-performance vacuum soldering system engineered for series production in microelectronics and semiconductor manufacturing. The compact system supports up to three integrated process chambers, maximizing throughput without increasing floor space requirements. Short cycle times, advanced vacuum soldering capability, and powerful IR heating ensure excellent temperature homogeneity and void-free solder joints. By evacuating the process chamber to less than 1 mbar and backfilling with ultra-pure nitrogen, the SRO i-LINE achieves oxygen levels below 3 ppm, while an integrated formic acid system ensures optimal wetting and solder quality.
Ersa will also showcase the Interflux ICSF Select6, a stand-alone spray fluxer that leverages advanced drop jet fluxing technology to deliver ultra-fast, highly precise flux application. Designed to integrate seamlessly with any wave soldering or selective soldering system, the ICSF Select6 enhances soldering performance by improving flux accuracy, reducing waste, and supporting consistent, high-quality solder joints across a wide range of applications.
For hand soldering operations, Ersa will present the i-CON TRACE soldering station, the company’s first fully networked platform. With built-in traceability, IoT connectivity, and CFX certification, i-CON TRACE provides detailed insight into hand soldering processes while supporting quality assurance, documentation, and compliance requirements.
Kurtz Ersa invites attendees to Booth #2113 to witness live demonstrations of these cutting-edge solutions and discover how their innovative technologies can optimize production efficiency, enhance reliability, and reduce operational costs.
For more information about Kurtz Ersa Inc., visit www.ersa.com.
