YINCAE Advanced Materials Co., Ltd. (YINCAE), a leading developer and manufacturer of high-performance semiconductor and electronic assembly materials, will exhibit at APEX 2026, March 17–19, at the Anaheim Convention Center in Anaheim, California.
At booth #4130, YINCAE will showcase advanced materials engineered to enhance reliability, optimize thermal performance, and improve manufacturing efficiency for next-generation semiconductor and electronic devices.
Featured solutions include:
❖ Underfill Materials for enhanced drop performance and thermal cycling reliability
❖ Die Attach & Structural Adhesives for high adhesion strength and high-temperature stability
❖ Thermal Interface Materials (TIMs) for superior heat dissipation
❖ High-Reliability Assembly Materials supporting AI/HPC, Automotive, communications, and advanced packaging applications
As device complexity increases, material performance becomes critical. YINCAE’s innovative solutions help manufacturers achieve higher yield, greater reliability, and robust performance in demanding environments.
Visit Booth #4130 to connect with our technical experts and discover solutions for your next semiconductor challenge. For more information: info@yincae.com | www.yincae.com
Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
