Stannol, a leader in soldering technology, will showcase its industry-leading solder paste portfolio at APEX EXPO 2026, taking place March 17–19 at the Anaheim Convention Center. Attendees can visit Booth 3525 to experience firsthand Stannol’s precision-engineered solutions for high-performance, reliable, and sustainable electronics assembly.
Precision. Performance. Sustainability.
Stannol solder pastes are designed to deliver consistent results across complex, high-mix assemblies as well as high-volume production. With a commitment to technical excellence and responsible materials, Stannol supports manufacturers seeking both quality and environmental responsibility.
Featured Products at APEX EXPO:
SP2200 – Proven Reliability for Demanding Applications
- Stable printing and safe residues for challenging lead-free processes
- Excellent first print, even after long downtime
- Long open time for reliable stencil printing
- L0 classified: good wetting with high electrical reliability
- Transparent, non-corrosive no-clean residues
- Compatible with all common lead-free surfaces
6000 Series – Performance Meets Flexibility
SP6000 – Versatile and Cost-Efficient
- One paste for standard and low-silver alloys (SAC305, TSC105)
- Excellent wetting in air or nitrogen
- Fine-pitch capable and highly reliable
- Very good first prints after production breaks
- Minimal, transparent residues
SP6500 – High Volume Excellence
- Outstanding print consistency for high-speed SMT
- Optimized for fine features down to 0.4 mm
- Excellent wetting on all common surfaces
- Long stencil life and 24-hour process stability
- Very low, transparent no-clean residues
- High tackiness for fast pick-and-place
- High yields, low tombstoning
SP6000 TBS04 – Low-Temperature Soldering
- Reliable LMPA soldering at reduced peak temperatures (~140 °C melting range)
- Reflow at just 170–180 °C reduces energy consumption and system wear
- Fine-pitch down to 0.4 mm, reflow in air or nitrogen
- Improved long-term reliability vs. pure BiSn alloys
greenconnect – Responsible Soldering by Design
Stannol’s greenconnect approach uses recycled solder materials, reducing CO₂ emissions by up to 85% compared to conventional solder pastes. Optimized process temperatures further conserve energy and resources, demonstrating that performance and sustainability can go hand in hand.
Visit Stannol at Booth 3525 to explore solder pastes engineered for precision, reliability, and responsible manufacturing.
For additional information, please visit www.stannol.com.
