Indium Corporation® will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo.
The company will feature various solutions ideal for power device packaging, ranging from pastes, solders, and tracking agents.
- InFORMS®are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- Indalloy®301LTfor Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
- AuLTRA® ThInFORMS® are 00035-inch-thick (0.00889mm, or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS® help combat common issues such as shorting and poor thermal transfer.
Learn more about FAST solutions at the Indium Corporation website and visit our experts at NEPCON Japan 2026, booth #E1-36.
About Indium Corporation
Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.
For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.
