Mastering BGA Rework with the PDR IR-E3 System

In the world of modern electronics, precision and reliability are everything. As components become smaller and more complex, effective BGA rework (Ball Grid Array rework) has become a critical part of PCB repair and production. For engineers, technicians, and manufacturers looking for accuracy, consistency, and control, the PDR IR-E3 Rework System stands out as one of the most advanced infrared rework solutions available today.

What Is BGA Rework and Why It Matters

BGA rework involves the process of removing, reballing, and replacing Ball Grid Array components on a printed circuit board. These components are essential for high-performance devices such as smartphones, computing hardware, automotive systems, and industrial electronics.
Because BGAs have solder joints hidden beneath the package, reworking them requires exceptional precision and temperature control. A small error in heat profiling or component alignment can result in solder bridging, pad damage, or complete component failure.

This is where intelligent, non-contact rework technology makes all the difference.

The PDR IR-E3 — Intelligent Infrared Rework for Demanding Applications

The PDR IR-E3 Rework System is designed specifically for precision BGA, QFN, and CSP rework on medium to large PCBs. Using advanced infrared (IR) heating technology, the IR-E3 delivers consistent and uniform thermal profiles without the turbulence or uneven heating often associated with hot air systems.

Key features include:

• Closed-loop temperature control for accurate and repeatable results
• Non-contact infrared heating to prevent PCB and component damage
• Real-time profiling software for process monitoring and documentation
• High-resolution optical alignment for precise component placement
• Lead-free compatible design, ideal for modern manufacturing requirements

Together, these features make the IR-E3 one of the most reliable systems for BGA rework, ensuring high yields, minimal risk, and excellent process visibility.

Why Choose Infrared Rework Over Hot Air

While hot air systems are still widely used, infrared rework offers clear advantages in control and safety. The PDR IR-E3 uses focused IR energy that heats components and solder joints precisely without disturbing nearby parts. This results in:

• Reduced thermal stress on sensitive components
• No risk of component movement due to air flow
• Consistent heating even on densely populated PCBs

The outcome is a cleaner, more stable rework process with fewer errors and less operator intervention.

Trusted Performance from Etek Europe and PDR

As an authorised supplier, Etek Europe provides full support for the PDR range of rework systems, including installation, training, and ongoing technical assistance. Our partnership with PDR ensures that our customers receive not only industry-leading equipment but also expert guidance to help maximise performance and ROI.

Whether you’re working in R&D, low-volume production, or repair, the PDR IR-E3 offers a dependable solution for precise BGA rework and advanced component repair.

Explore the PDR IR-E3 Rework System

If your business depends on consistent, high-quality results, the PDR IR-E3 is the professional choice for modern electronics rework.

Contact Etek Europe today to learn more about the IR-E3 system, arrange a demonstration, or discuss your specific rework requirements.