YINCAE, a global leader in advanced electronic materials, will showcase its latest innovations at SMTA International 2025, October 21–23, at the Donald E. Stephens Convention Center in Rosemont, Illinois.
Visitors will explore cutting-edge solutions designed to address reliability, thermal
management, and processing challenges in semiconductor, microelectronics, and PCB
assembly applications.
Explore YINCAE’s Technology:
- Underfill Materials – Strengthen solder joints and improve thermal performance for
fine-pitch, flip-chip, and advanced packaging, while simplifying assembly. - Die Attach Adhesives – High-performance adhesives for optimal heat dissipation,
mechanical stability, and durability in high-power, high-reliability devices. - Board-Level Assembly Materials – Solder pastes, adhesives, and encapsulants that
boost yield, reduce defects, and enable precise, reliable PCB assembly. - Wafer-Level & Optoelectronic Materials – Materials for wafer-to-wafer, chip-to-substrate, and LED/optical device packaging that streamline production and enhance
device performance. - Thermal Interface Materials – Advanced TIMs for efficient heat transfer in AI, 5G,
power electronics, and high-density assemblies.
YINCAE’s portfolio empowers manufacturers to push performance boundaries, enhance
reliability, and improve production efficiency in next-generation electronics.
Visit Booth #2551 to see these innovations in action. For more information, email
info@yincae.com or visit www.yincae.com.
