MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to have received the 3D InCites Technology Enablement Award for its latest advanced packaging solution, the NOVAFAB® Fine Grain Copper electroplating process. Recognized by one of the industry’s most respected platforms in advance packaging, the award underscores NOVAFAB’s role in advancing hybrid bonding, addressing interconnect reliability challenges in advanced packaging architectures.
As the semiconductor industry pushes toward smaller nodes and greater functionality in advanced packaging, fabricators face growing challenges in reliably creating fine-pitch, high-performance interconnects. NOVAFAB Fine Grain Copper addresses these challenges by producing a unique, ultra-pure, copper film that ensures reliability and performance of high-density interconnects within advanced applications such as high-speed computing.
Engineered for wafer-level packaging applications, NOVAFAB Fine Grain Copper excels in hybrid bonding. The award-winning technology enables controlled grain growth during annealing, ensuring the formation of defect-free bonds, significantly enhancing quality and reliability. The ultra-pure copper film minimizes signal degradation, improving overall device performance and reliability. With a <0.2μm grain size, the copper deposit is adaptable for small features, making it ideally suited for applications requiring high-density interconnects with advanced mechanical and electrical demands.
“NOVAFAB Fine Grain Copper represents the latest innovation in our Fine Grain Portfolio, designed to address key challenges in heterogeneous integration and hybrid bonding”, comments Eric Gongora – Vice President, Wafer Level Packaging at MacDermid Alpha. “MacDermid Alpha’s innovation continues to set a benchmark in the industry, with this award for ‘Technology Enablement’ standing as a testament to our position as a pioneer in performance chemistry. With one of the broadest product and technology portfolio offerings, our R&D and Application teams continue to drive the leading edge of technology for the advanced packaging industry.”
Award-Winning NOVAFAB Fine Grain Copper delivers:
- Ultra-fine <0.2μm grain size enabling high-density interconnects
- Controlled grain growth for defect-free hybrid bonding
- Ultra-pure copper for minimal signal loss/degradation
- Enhanced reliability and performance for advanced nodes
For more information on our advanced interconnect metallization solutions that are designed to support customers in achieving their reliability, performance and environmental objectives, contact our wafer level packaging experts: www.macdermidalpha.com/contact-us
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